Intel and AMD are now teamed up to produce new Intel chip that combines Intel's processor and AMD custom Graphics. This chips will be available for both notebooks and ultrabooks to create both portability and performance go hand in hand. This avails high performance gaming in light and thin notebook PCs.
The AMD-Intel chip will be an Intel's 8th generation,H series core chips which comes with power management for entire module that saves up lot of your juice.It scheduled to ship in first of 2018.
As both the companies made these chip but this is Intel's project but Intel first approached AMD for the project.
Intel inroduces a new technology called EMIB-Embedded Multi-die Interconnect Bridge which is a piece of silicon which combines AMD's Graphic cores and High Bandwidth Memory HBM2. This EMIB technology reduces the cost as there is no need of interposers. This technology avails multiple silicon dies in single module which saves up space. The module will be 1900 square millimeters that is 2.9 square inches consists of CPU, GPU and Memory laid next one another. This module will use half of the memory power of the traditional design.
Heat is an issue for high performance thin notebooks but Intel added a new power-sharing framework to their new module consists of new connection between CPU, GPU and memory. This new power framework can do a lot load of power management. This allow the system to balance the three components dynamically,based on workload,state and the cooling system of chassis. The integrated 8th generation chip can handle 4k video using HEVC and VP9 codecs.
The main thing is that we don't know what will be the specs of these chips that is clocks of these chips,architecture of CPU,architecture of GPU that is whether it is of Vega architecture,memory and the cost of these chips. These details will be available when these chips will launch. Lets wait for that day when the two arch rivals will launch their co-created product.
Third party image reference
As both the companies made these chip but this is Intel's project but Intel first approached AMD for the project.
Third party image reference
Intel inroduces a new technology called EMIB-Embedded Multi-die Interconnect Bridge which is a piece of silicon which combines AMD's Graphic cores and High Bandwidth Memory HBM2. This EMIB technology reduces the cost as there is no need of interposers. This technology avails multiple silicon dies in single module which saves up space. The module will be 1900 square millimeters that is 2.9 square inches consists of CPU, GPU and Memory laid next one another. This module will use half of the memory power of the traditional design.
Third party image reference
Heat is an issue for high performance thin notebooks but Intel added a new power-sharing framework to their new module consists of new connection between CPU, GPU and memory. This new power framework can do a lot load of power management. This allow the system to balance the three components dynamically,based on workload,state and the cooling system of chassis. The integrated 8th generation chip can handle 4k video using HEVC and VP9 codecs.
Third party image reference
The main thing is that we don't know what will be the specs of these chips that is clocks of these chips,architecture of CPU,architecture of GPU that is whether it is of Vega architecture,memory and the cost of these chips. These details will be available when these chips will launch. Lets wait for that day when the two arch rivals will launch their co-created product.
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